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Less shading


Higher efficiency
Narrow line width - lowers light shading
Improved series resistance due to:
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High finger aspect ratio (line conductivity)
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Low finger spacing
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Robust contact resistance
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Highly uniform fingers
Improved light capture by:
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Controlled finger face angle enabling light reflectance to wafer

Improved light capture

Lower cost
Ultra-narrow finger width
Super-fine fingers - as low as 5 microns width
Exceptional high aspect ratio - as high as 3:1
Superior finger uniformity
Simple process
Same metallization chemistry as current silver pastes
Significant reduction of silver consumption
Low capital investment
Lumet CAPEX is 80% less than screen printing
Significantly lower OPEX and CAPEX


Solar Cell Fingers Comparison



Multi-layer fingers



©2024 Lumet Technologies Ltd. The information contained herein is subject to change without notice.
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